Q. ZHANG; H. DENG; K. SONG. Breaking Physics Limits: How 2nm Chip Technology Powers Next-Gen 3D ICs. Fusion of Multidisciplinary Research, An International Journal, [S. l.], v. 6, n. 1, p. 685–706, 2025. DOI: 10.63995/BRIT1756. Disponível em: https://fusionproceedings.com/fmr/1/article/view/77. Acesso em: 24 may. 2026.